Chip compression-bonding apparatus and method

Details Chip compression-bonding apparatus and method Chip compression-bonding apparatus and method

1997-11-28

1999-11-16

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156360, 156362, 156363, 156538, 2281791, 22818021, 22818022, 2282351, B32B 3100, B23K 3102

Patent

active

059850647

ABSTRACT:
A chip compression-bonding apparatus includes a vertically-movable block which is vertically moved by a descending device, and has a load measurement device and a load applying device mounted thereon. A compression-bonding tool for holding a chip is provided beneath the vertically-movable block. The weight of the compression-bonding tool is supported by the load measurement device, and the compression-bonding tool is pressed against the load measurement device by the load applying device. A control portion detects a compression-bonding force of the compression-bonding tool by an amount of reduction of the value of the load measured by the load measurement device, and controls the descending device in accordance with the detected compression-bonding force.

REFERENCES:
patent: 4899921 (1990-02-01), Bendat et al.
patent: 5462217 (1995-10-01), Simmons et al.

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