Chip composite electronic component with improved moisture resis

Details Chip composite electronic component with improved moisture resis Chip composite electronic component with improved moisture resis

1997-05-29

1999-04-27

Kincaid, Kristine

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361766, 338195, 338308, H01G 406, H05K 116

Patent

active

058985638

ABSTRACT:
Disclosed are a structure and a method of manufacture of a chip composite electronic component with improved moisture resistance. A pair of end electrodes are formed on a surface of the substrate at opposite end portions thereof. An intermediate electrode is formed at a location between the end electrodes on the surface of the substrate. The intermediate electrode includes a lower electrode, a resistor electrode and a pad electrode formed continuous therebetween. Another element is formed on the lower electrode so as to be electrically connected between the lower electrode and one of the end electrodes. A resistance element is formed between the other of the end electrodes and the resistor electrode. A glass layer is formed to cover another element, the resistance element and the pad electrode. A protective layer of a synthetic resin is formed to cover the entire surface of the glass layer and part of each the end electrode.

REFERENCES:
U.S.. application No. 08/719,417, Massonori Taniumra, filed Sep. 9, 1996.

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