Chip-component accommodating device and examining apparatus...

Details Chip-component accommodating device and examining apparatus... Chip-component accommodating device and examining apparatus...

2006-09-12

2006-09-12

Arbes, Carl J. (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S739000, C029S759000, C083S591000

Reexamination Certificate

active

07103967

ABSTRACT:
According to the present invention, in the field of packaging the chip component, increase in speed and stability in packaging the chip component is achieved without significantly increasing the cost of the device. The size of the suction face of the suction nozzle is set so as to be larger than the relevant chip component. Near the inserting position P of the chip component, a push cover is provided in close proximity to the upper surface of the carrier tape. A hole is provided in the push cover at the inserting position P, and the size of the hole is slightly larger than the size of the tip face of the suction nozzle. After the chip component held to the suction nozzle enters the component-accommodating recess of the carrier tape, the suction of the suction nozzle is released and the carrier tape starts to move in the direction shown with an arrow, orthogonal to the suction nozzle. The suction nozzle is raised after the opening of the component-accommodating recess is completely under the push cover.

REFERENCES:
patent: 6594887 (2003-07-01), Okuda et al.
patent: 6634159 (2003-10-01), Muto et al.
patent: 6742675 (2004-06-01), Saito et al.
patent: 6926797 (2005-08-01), Okawa et al.
patent: 5-81004 (1993-11-01), None

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