Chip coater

Coating apparatus – Solid applicator contacting work – Movably mounted applicator

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Details

118265, 118268, 118270, 118256, 118401, 118421, 118422, B05C 106, B05C 318

Patent

active

043948448

ABSTRACT:
An apparatus for applying an epoxy glue, solder paste or a similar material to the surface of a planar circuit chip, such as a silicon integrated circuit chip. Positioned just above the liquid epoxy in the bath is a fine mesh, stainless steel screen clamped at its periphery and having supported thereover a leveling paddle with a micrometer adjustment rotatable relative to the bath itself for smoothing the material over the screen surface. After this smoothing or leveling operation, the chip, usually held by a vacuum chuck, is pressed against the screen into the epoxy with the screen functioning as a resilient means enabling the chip to be withdrawn therefrom with uniform deposition of material applied to the undersurface thereof. The apparatus may also have a spongy material such as polyurethane or a sponge neoprene rubber under the screen to enhance chip removal.

REFERENCES:
patent: 830049 (1906-09-01), Brickett
patent: 1493809 (1924-05-01), Croddy
patent: 3003461 (1961-10-01), Rosenthal

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