Chip carrier with protective coating for circuitized surface

Details Chip carrier with protective coating for circuitized surface Chip carrier with protective coating for circuitized surface

1992-07-06

1993-09-28

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 522, 228214, 257738, 257759, 26427217, 428901, 437211, H05K 720

Patent

active

052491013

ABSTRACT:
A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 10,000 psi. As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.

REFERENCES:
patent: 4582862 (1986-04-01), Berner et al.
patent: 4633573 (1987-01-01), Scherer
patent: 4784872 (1988-11-01), Moeller
patent: 4806574 (1989-02-01), Krajewski et al.
patent: 4973611 (1990-11-01), Puder
patent: 4985523 (1991-01-01), Mochizuki et al.
patent: 4992547 (1991-02-01), Berner et al.
patent: 4999699 (1991-03-01), Christie et al.
patent: 5039715 (1991-08-01), Bachmann et al.
patent: 5053357 (1991-10-01), Lin
patent: 5089440 (1992-02-01), Christie
patent: 5120678 (1992-06-01), Moore
patent: 5121190 (1992-06-01), Hsiao
patent: 5128746 (1992-07-01), Pennisi
patent: 5173764 (1992-12-01), Higgins

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