Chip carrier substrates of hybrid woven glass cloths

Details Chip carrier substrates of hybrid woven glass cloths Chip carrier substrates of hybrid woven glass cloths

1983-01-13

1983-11-08

Bell, James J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

139420C, 428225, 428257, 428252, 428259, 428446, 428901, B32B 516

Patent

active

044142641

ABSTRACT:
Multilayer laminates and substrates for carriers of silicon chips which are used in circuitry boards will comprise woven hybrid glass cloth formed from fiberglass and a second material which possesses a coefficient of thermal expansion of less than about 5.0.times.10.sup.-6 in/in/.degree.C. The resulting laminates will be thermally and dimensionally stable. As an example, a hybrid glass cloth may be formed in which the warp yarn of said cloth is fiberglass and the fill yarn is boron nitride. The resulting cloth may be used to form laminates which possess a coefficient of thermal expansion similar in nature to that of a chip carrier such as ceramic, thus minimizing the danger of a solder fracture.

REFERENCES:
patent: 4201247 (1980-05-01), Shannon
patent: 4304811 (1981-12-01), David et al.

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