Chip carrier package with optical vias

Details Chip carrier package with optical vias Chip carrier package with optical vias

2008-03-31

2009-02-03

Healy, Brian M (Department: 2883)

Optical waveguides

Integrated optical circuit

C385S031000, C385S049000, C385S088000, C385S092000

Reexamination Certificate

active

07486847

ABSTRACT:
Considerable manufacturing efficiency and flexibility is provided by configuring the lower surface of a chip carrier to include multiple holes specifically designed to receive coupling fibers. By appropriately positioning these holes, the coupling fibers can be aligned with necessary optical elements of optoelectronic chips carried by the chip carrier. Similarly, the opposite end of the fibers can be appropriately configured and positioned for coupling to waveguide structures or fiber optic structures which may be embedded in printed circuit boards. By utilizing an appropriately configured chip carrier, and related fibers, a signal transmission structure is achieved which effectively bridges the gap between a chip carrier and a related printed circuit board.

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“High-Efficiency and Stable Optical Transmitter Using VCSEL-Direct-Bonded Connector for Optical Interconnection”, Do-Won Kim, Tae-Woo Lee, Mu Hee Cho and Hyo-Hoon Park;Optics Expressv15, n24, Nov. 26, 2007.
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“High-Coupling-Efficiency Optical Interconnection Using a 90° -Bent Fiber Array Connector in Optical Printed Circuit Boards” Mu Hee Cho, Sung Hwan Hwang, Ha Seo Cho and Hyo-Hoon Park;IEEE Photonics Technology Letters, v17, n3, Mar. 2005.

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