Chip carrier package

Details Chip carrier package Chip carrier package

1983-12-02

1987-02-10

James, Andrew J.

357 74, 357 72, H01L 2348, H01L 2330

Patent

active

046426701

ABSTRACT:
Described is an improved lead design for an integrated circuit chip carrier. The lead incorporates a U- or V-bend in the portion of the lead extending along the edge of the chip carrier to adapt the lead to either surface or socket mounting. The bend can also be used for locking the lead into the socket and, in conjunction with grooves in the sidewall of the chip carrier, for lead alignment retention.

REFERENCES:
patent: 4272140 (1981-06-01), Lychyk et al.
patent: 4463217 (1984-07-01), Orcutt
patent: 4495376 (1985-01-01), Hightower et al.

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