Chip carrier mounting device

Details Chip carrier mounting device Chip carrier mounting device

1984-05-14

1987-11-10

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 563, 228185, 439 70, 439876, H01L 2160, H01L 2158

Patent

active

047052058

ABSTRACT:
A chip carrier mounting device which is hereinafter also referred to as an "interconnection preform placement device" includes a retaining member having a predetermined pattern of apertures in which are positioned preforms of joint-forming material such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatique. A method of forming resilient interconnections comprises placing the interconnection retaining member device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms. The joint-forming material may be a filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.

REFERENCES:
patent: 3070650 (1962-12-01), Stearns
patent: 3148310 (1964-09-01), Feldman
patent: 3373481 (1968-03-01), Lins et al.
patent: 3467765 (1969-09-01), Croft
patent: 3472365 (1969-10-01), Tiedema
patent: 3591839 (1971-07-01), Evans
patent: 3616532 (1971-11-01), Beck
patent: 3680037 (1972-07-01), Nellis et al.
patent: 3795884 (1974-03-01), Kotaka
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 3839727 (1974-10-01), Herdzik et al.
patent: 3861135 (1975-01-01), Seeger, Jr. et al.
patent: 3862791 (1975-01-01), Miller
patent: 3871015 (1975-03-01), Lin et al.
patent: 3900153 (1975-08-01), Beerwerth et al.
patent: 3921285 (1975-11-01), Krall
patent: 3926360 (1975-12-01), Moister, Jr.
patent: 3991463 (1976-11-01), Squitieri et al.
patent: 4003621 (1977-01-01), Lamp
patent: 4027936 (1977-06-01), Nemoto et al.
patent: 4064623 (1977-12-01), Moore
patent: 4067104 (1978-01-01), Tracy
patent: 4089575 (1978-05-01), Grabbe
patent: 4109378 (1978-08-01), Davies
patent: 4130327 (1978-12-01), Spaulding
patent: 4179802 (1979-12-01), Joshi et al.
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4201435 (1980-05-01), Nakamura et al.
patent: 4209893 (1980-07-01), Dyce et al.
patent: 4240198 (1980-12-01), Alonso
patent: 4290195 (1981-09-01), Rippere
patent: 4295700 (1981-10-01), Sado
patent: 4334727 (1982-06-01), Scheingold et al.
patent: 4354629 (1982-10-01), Grassauer et al.
patent: 4390220 (1983-06-01), Benasutti
patent: 4402450 (1983-09-01), Abraham et al.
patent: 4402562 (1983-09-01), Sado
patent: 4412642 (1983-11-01), Fisher, Jr.
patent: 4433887 (1984-02-01), Sado et al.
patent: 4458968 (1984-07-01), Madden
patent: 4487638 (1984-12-01), Hoge
Abolafia "Chip Interconnection Device", IBM Tech. Disclosure Bulletin; vol. 15, No. 2; 7/1972; p. 420.
Druschel et al, "Integrated Stacking Spacer", IBM Tech. Disclosure Bulletin; vol. 21, No. 6; 11/1978; pp. 2322-2324.
"Data Sheet CEC-011", Technical Wire Products, Inc.; Santa Barbara, Calif.; 1974.
A Guide to Preform Soldering, Alloys Unlimited Inc., 1959.

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