Chip carrier mounting arrangement

Details Chip carrier mounting arrangement Chip carrier mounting arrangement

1984-12-31

1986-04-08

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 685, 361400, 361404, 361408, H05K 118

Patent

active

045816808

ABSTRACT:
A leadless ceramic chip carrier for surface mounting on an epoxy printed circuit board is shown featuring an arrangement for relieving the thermally induced stress by progressively lengthening the attaching solder pillars as the distance from the center line of the ceramic chip increases to avoid exceeding the elastic limits of the solder.

REFERENCES:
patent: 3149266 (1964-09-01), Lipton
patent: 3373481 (1968-03-01), Lins et al.
patent: 3486223 (1969-12-01), Butera
patent: 3777270 (1973-12-01), Tatsuko et al.
patent: 4238527 (1980-12-01), Monnier et al.
patent: 4417296 (1983-11-01), Schelhorn
patent: 4437141 (1984-03-01), Prokop
E. Stephens, Pinless Module Connector, IBM Tech. Disc. Bull., V. 20 #10, Mar. 1978, p. 3872.

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