Chip carrier having copper pattern plated with gold on one surfa

Details Chip carrier having copper pattern plated with gold on one surfa Chip carrier having copper pattern plated with gold on one surfa

1994-12-28

1995-08-29

Ledynh, Bot L.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361768, 361777, 361760, 174 522, 174260, 174263, 257779, 257786, 257787, H05K 702, H05K 118, H01L 2328

Patent

active

054466253

ABSTRACT:
A chip carrier (20) includes a substrate (11) having a first copper pattern (12) deposited on a first surface (13), and a second copper pattern (14) deposited on a second surface (16). The second copper pattern (14) is plated with a metallic material to form wire bondable areas (18) on the second copper pattern (14), however, the first copper pattern (12) is substantially devoid of the metallic material. A device (21) is wire bonded to the wire bondable areas (18) of the second copper pattern (14), and a protective covering (23) covers the wire bondable areas (18).

REFERENCES:
patent: 5075965 (1991-12-01), Carey et al.
patent: 5153051 (1992-10-01), Dorinski
patent: 5162144 (1992-11-01), Brown et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
Electronic Packaging and Production, A Cahners Publication, May 1992.
Microstructures and Mechanical Properties of Aging Materials, A Publication of TMS, Minerals, Metals & Materials, Proceedings of a Symposium sponsored by the Minerals, Metals and Materials Socciety held in conjunction with ASM International, pp. 431-442. Nov. 2-5, 1992.

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