Chip carrier having an organic photopatternable material and a m

Details Chip carrier having an organic photopatternable material and a m Chip carrier having an organic photopatternable material and a m

1996-05-21

1998-03-03

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 174255, 174256, 174258, 257697, 257700, 257707, 257737, 361719, 361720, 361761, 361762, 361764, 361774, 361807, 361809, H05K 105, H05K 103, H05K 118, H01L 2336

Patent

active

057242321

ABSTRACT:
A chip carrier for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer, having plated photo-vias, to electrically interconnect two (or more) layers of fan-out circuitry. This chip carrier further employs a single-tiered cavity to contain a chip, rather than a multi-tiered cavity, as is conventional. Moreover, this chip carrier includes thermal via holes and/or a metallic layer, directly beneath the chip, to enhance heat dissipation.

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IBM Technical Disclosure Bulletin "Photoformed Chip Carrier" vol. 28 No. 7, Dec. 1985.

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