Chip carrier having a chip mounted on an organic dielectric subs

Details Chip carrier having a chip mounted on an organic dielectric subs Chip carrier having a chip mounted on an organic dielectric subs

1997-06-06

2000-03-14

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174255, 174258, 361764, 361762, 361707, 361719, 430312, H05K 103, H05K 702

Patent

active

06038137&

ABSTRACT:
A chip carrier for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer, having plated photo-vias, to electrically interconnect two (or more) layers of fan-out circuitry. This chip carrier further employs a single-tiered cavity to contain a chip, rather than a multi-tiered cavity, as is conventional. Moreover, this chip carrier includes thermal via holes and/or a metallic layer, directly beneath the chip, to enhance heat dissipation.

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IBM Technical Disclosure Bulletin "Photoformed Chip Carrier" vol. 28 No. 7, Dec. 1985.

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