Chip carrier for high frequency power components cooled by water

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 803, 361385, 361401, 361403, H05K 720

Patent

active

046226214

ABSTRACT:
A chip carrier is provided for power components operating at high frequency, comprising a main heat conducting body with a cavity in which said component is housed, and forced flow fluid ducts. The chip carrier is inserted in a window cut out in a printed circuit board. A projecting flange bears against the edge of the window, whereas flat electrodes, extending from the carrier in the same plane as the flange, bear against connections printed on the board. Below the board, the cooling fluid forced flow channels are connected to delivery and discharge ducts.

REFERENCES:
patent: 3741292 (1973-06-01), Aakalv
patent: 4079410 (1978-03-01), Schierz
patent: 4216488 (1980-08-01), Hutson
patent: 4341432 (1982-07-01), Cutchaw
patent: 4504886 (1985-03-01), Cygan
patent: 4577402 (1986-03-01), Swanstrom

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Chip carrier for high frequency power components cooled by water does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip carrier for high frequency power components cooled by water, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip carrier for high frequency power components cooled by water will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-380246

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.