Chip carrier for an integrated circuit assembly

Details Chip carrier for an integrated circuit assembly Chip carrier for an integrated circuit assembly

1992-04-09

1993-11-16

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257729, 257783, H01L 2302, H01L 3902

Patent

active

052626741

ABSTRACT:
Epoxy bonding between an IC chip and a chip carrier is strengthened by creating substantially rougher oxidized surfaces within substantially smooth gold surfaces of a die paddle portion of the chip carrier.

REFERENCES:
patent: 4767049 (1988-08-01), Butt et al.
patent: 4769345 (1988-09-01), Butt et al.
patent: 4823234 (1989-04-01), Konishi et al.
patent: 4937653 (1990-06-01), Blonder et al.
patent: 4970579 (1990-11-01), Arldt et al.

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