Patent
1991-01-23
1992-10-13
James, Andrew J.
357 70, 357 72, H01L 2348
Patent
active
051555751
ABSTRACT:
A chip carrier for a microwave semiconductor component with four external electrical contacts has a favorable operating and application behavior, even when a plastic housing is used. Two external source terminals are connected with each other as one pieve via a cross member. The cross member basically proceeds obliquely to a transverse axis or to a longitudinal axis of the chip carrier.
REFERENCES:
patent: 4446375 (1984-05-01), Aird
patent: 4794431 (1988-12-01), Park
Japan Patent Specifications, vol. 9, No. 263 (1986), Oct. 19, 1985, Kazuo Kanbayashi "Semiconductor Device".
Japan Patent Specifications, vol. 10, No. 268, Sep. 12, 1986, Seizo Akasaka, "High-Frequency Ground Structure of Semiconductor Chip".
Japan Patent Specifications, vol. 11, No. 108, Apr. 4, 1987, Tetsuo Mori "Microwave Transistor Device".
Japan Patent Specifications, vol. 12, No. 174, May 24, 1988, Yoshie Nomura, "High-Frequency Transistor".
James Andrew J.
Nguyen Viet Q.
Siemens Aktiengesellschaft
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