Chip carrier and method of fabrication

Details Chip carrier and method of fabrication Chip carrier and method of fabrication

1987-11-20

1989-02-28

Pellinen, A. D.

Electricity: electrical systems and devices

Miscellaneous

361408, 357 70, 357 80, 174 524, H01R 909

Patent

active

048091359

ABSTRACT:
A ceramic chip carrier comprising a ceramic substrate and a copper lead frame directly bonded to the substrate, the lead frame being formed to provide leads in fringe regions beyond the edges of the substrate which are connected together by a removable rim and adapted to be suitably formed to make electrical and mechanical contact with the conductive runs on a printed circuit board.

REFERENCES:
patent: 3643133 (1972-02-01), Towell
patent: 3673309 (1972-06-01), Dalmasso et al.
patent: 3689336 (1972-09-01), Bunker et al.
patent: 4017770 (1977-04-01), Valfre
patent: 4079511 (1978-03-01), Grabbe
patent: 4408218 (1983-10-01), Grabbe
patent: 4567545 (1986-01-01), Mettler, Jr.

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