Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1988-10-24
1989-05-02
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
206328, 439331, 439525, H01R 2372
Patent
active
048264407
ABSTRACT:
An I.C. chip carrier and header assembly is provided. The assembly comprises a generally rectangular shrouded header with pins force fit therein. The pins are connectable to conductive traces on a printed circuit. A protective tape may be disposed over the header to control the locations at which conformal coatings may be applied, and thereby avoid extensive cleaning operations. The assembly further comprises a carrier with receptacles for receiving box-type double female carrier terminals. The I.C. chip is mountable in the carrier with the leads thereof being connectable to the carrier terminals by soldering. A cover is locked into engagement with the carrier to define a plugable subassembly. The subassembly is then urged into lockable but removable engagement with the header and the pins thereof.
REFERENCES:
patent: 3568136 (1971-03-01), Wells
patent: 4026412 (1977-05-01), Henson
patent: 4417777 (1983-11-01), Bamford
patent: 4603930 (1986-08-01), Ito
patent: 4702706 (1987-10-01), Sadigh-Behzadi
Colleran Stephen A.
Plocek Edward J.
Roberts James T.
Silbernagel Raymond A.
Abrams Neil
Cornell John W.
Hecht Louis A.
Molex Incorporated
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