Electrical resistors – Incased – embedded – or housed – Element in insulation with outer metallic sheath
Patent
1987-06-12
1988-11-01
Edlow, Martin H.
Electrical resistors
Incased, embedded, or housed
Element in insulation with outer metallic sheath
357 71, 357 70, 357 13, 357 236, 357 80, 338308, 361 56, 361402, 361414, H01L 2348, H01L 2990, H01L 3902, H01C 1012
Patent
active
047823810
ABSTRACT:
A chip carrier for carrying integrated circuit chips is provided. Instead of placing individual circuit components either in the chips or next to them, the components are placed in or near the substrate of the chip carrier. This frees up expensive real-estate for logic chips at the chip level presently occupied by the components. The substrate of the carrier acts as a large heat sink to dissipate power generated by the components.
REFERENCES:
patent: 3368116 (1968-02-01), Spaude
patent: 4015147 (1977-03-01), Davidson et al.
patent: 4106048 (1978-08-01), Khajezadeh
patent: 4151542 (1979-04-01), Yajima et al.
patent: 4258311 (1981-03-01), Tokuda et al.
patent: 4627151 (1986-12-01), Mulholland et al.
patent: 4714952 (1987-12-01), Takekawa et al.
Bodendorf, D. J., "Active Silicon Chip Carrier", IBM Technical Disclosure Bulletin, vol. 15, No. 2, Jul. 1972, pp. 656-657.
Chao Clinton
Ruby Richard C.
Edlow Martin H.
Hewlett--Packard Company
Hickman Paul L.
Howard William H. F.
Limanek Robert
LandOfFree
Chip carrier does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chip carrier, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip carrier will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-893950