1989-08-02
1990-09-04
Hille, Rolf
357 68, 357 65, H01L 3902
Patent
active
049548778
ABSTRACT:
The present invention relates to a chip carrier, on which LSI chips are mounted and a chip carrier is disclosed, in which a region where power source throughholes are arranged and a region where signal throughholes are arranged are separated from each other and a coupling capacitor is formed only in the region where the power source throughholes are arranged with an intention to reduce noise.
REFERENCES:
patent: 3968193 (1976-07-01), Langston, Jr. et al.
patent: 4082394 (1978-04-01), Gedney et al.
patent: 4221047 (1980-09-01), Narken et al.
patent: 4407007 (1983-09-01), Desai et al.
patent: 4649417 (1987-03-01), Burgess et al.
Nakanishi Keiichirou
Ogihara Satoru
Shinohara Hiroichi
Suzuki Hideo
Yamada Minoru
Hille Rolf
Hitachi , Ltd.
Le Hoang-anh
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