Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-06-09
1999-12-28
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361761, 361764, 361782, 361803, 235491, 235492, 257679, H01L 23051, H05K 118
Patent
active
060089938
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to chip cards with a chip support element with at least one chip and a coil support element with at least one coil for the contact-free transfer of energy and data to a card terminal apparatus as well as a method for the production of such chip cards.
2. Brief Description of the Background of the Invention Including Prior Art
Chip cards (combination chip cards, hybrid cards) have become known from the German printed patent document DE 39 35 364, which chip cards can exchange energy and data both free of contacts as well as with operating contacts with their terminal apparatus (read apparatus/write apparatus). These cards can be employed for multiple applications such as, for example, telephone cards, health cards, access control cards. These cards can be employed for multiple applications such as, for example, telephone cards, health cards, access control cards.
According to the state of the art, contact-free operating chip cards are produced by connecting a chip fixedly to the coil support element and subsequently embedding the chip at the card producer as a complete device component into the plastic material of a card. This is associated with the disadvantage that fairly large and mechanically sensitive device components (chip+foil with coil) have to be transported to the card producer. In addition, card bodies cannot be manufactured in advance at the card producer, since the device component which contains chip and foil with coil has to be entered into the card body prior to the production of a card (for example, a card with imprint).
An integrated circuit card (IC card) and a method for its production has become known from the German printed patent document DE 41 05 869 A1, wherein conductor-path net, induction coils, and contact faces are placed on one side without cross-over onto an integrated circuit card (IC card) or, respectively, onto a support of the semiconductor chip. Antenna paths are formed by conductor paths on a flexible foil in the same way as the externally accessible contacts are realized on this foil. The integrated circuit chips (IC chips) are disposed on the support and are in each case surrounded by a stiffening collar. The chip itself is connected through bonding wires to the contact locations on the foil.
It is known from the European printed patent document EP 0 595 549 A2 to connect electrically and mechanically a chip with a coil-shaped conductor-path structure on a foil by applying an electrically conducting adhesive on the contact locations. Upon bringing together the chip with the foil, the contacts disposed on the surface of the chip are electrically connected to the conductor paths.
SUMMARY OF THE INVENTION
1. Purposes of the Invention
It is an object of the invention to provide for the mounting of chip cards with their different electronic function elements in a simple way, as well as, on the one hand, to produce the card bodies independent of the chip assembly and, on the other hand, to mount the chips behind the contact faces and to be able to produce the chip cards in a series production as is the case with pure contact cards, and to render the two modules, namely the chip support element and the coil support element separately testable, including their later conducting connection.
These and other objects and advantages of the present invention will become evident from the description which follows.
2. Brief Description of the Invention
The solution of the object according to an invention comprises a chip card containing the two parts, chip support element and coil support element, wherein the chip support element is comprised of a contact-face support element. The contact-face support element is electrically connected to at least one electronic chip and exhibits contact faces, accessible from the outside, providing card contacts for connecting the chip to contacts in a card terminal apparatus. The chip is disposed on the side of the chip support element disposed remote from the contact fac
REFERENCES:
patent: 5057679 (1991-10-01), Audic et al.
patent: 5519201 (1996-05-01), Templeton, Jr. et al.
patent: 5598032 (1997-01-01), Fidalgo
patent: 5612532 (1997-03-01), Iwasaki
patent: 5710458 (1998-01-01), Iwasaki
patent: 5880934 (1999-03-01), Haghiri-Tehrani
Patent Abstract of Japan No JP6336096 published Dec. 6, 1994.
Angeuandte Digital Electronik GmbH
Kasper Horst M.
Picard Leo P.
Vigushin John B.
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