Chip card module

Registers – Coded record sensors – Particular sensor structure

Reexamination Certificate

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Details

C235S492000, C438S253000

Reexamination Certificate

active

07337967

ABSTRACT:
A chip card module having a carrier with contact areas. Arranged on the carrier lying opposite the contact areas is a semiconductor chip, which has an integrated circuit which has on a surface of the chip terminal contacts which are connected in an electrically conducting manner to assigned contact areas. The contact areas have a first conducting layer and a second conducting layer, with cluster elements embedded in the second conducting layer.

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Kathryn et al. (Compliant bumps for adhesive flip-chip assembly), Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on [see also Components, Hybrids, and Manufacturing Technology, IEEE Transactions on], vol. 18, Issue 3, Aug. 1995, pp. 503-510.

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