Chip card micromodule as a surface-mount device

Details Chip card micromodule as a surface-mount device Chip card micromodule as a surface-mount device

1996-05-28

1999-06-29

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257679, 257773, 361737, H05K 111

Patent

active

059177063

ABSTRACT:
A micromodule is used as a surface-mounted package on a substrate of interconnections. In one embodiment of the invention, barriers to the expansion of solder are formed between contact zones of the micromodule and corresponding contact pads of the substrate. A mechanical stopping device is planned to keep the thickness of the interface of solder. In another embodiment of the invention, contact zones are extended by tongues. A cambering operation enables the formation of the surface-mounting pins.

REFERENCES:
patent: 4017889 (1977-04-01), Miller
patent: 4990759 (1991-02-01), Gloton et al.
patent: 5001829 (1991-03-01), Schelhorn
patent: 5041395 (1991-08-01), Steffen
patent: 5075759 (1991-12-01), Moline
patent: 5147982 (1992-09-01), Steffen
patent: 5216278 (1993-06-01), Lin et al.
patent: 5309021 (1994-05-01), Shimamoto et al.
patent: 5325072 (1994-06-01), Kohjiro et al.
patent: 5477086 (1995-12-01), Rostoker et al.
patent: 5477419 (1995-12-01), Goodman et al.
patent: 5559372 (1996-09-01), Kwon
patent: 5569879 (1996-10-01), Gloton et al.
patent: 5585669 (1996-12-01), Venambre
patent: 5631809 (1997-05-01), Takagi et al.
patent: 5640306 (1997-06-01), Gaumet et al.
IBM Technical Disclosure Bulletin "Microelectronic Device Standoffs" by L.F. Miller vol. 8 No. 3 p. 380, Aug. 1965.
IBM Technical Disclosure Bulletin "Semiconductor Module Structure" by Ainslie et al. vol 14 No. 1 p. 246, Jun. 1971.
IBM Technical Disclosure Bulletin Thermal Stress Resistant Solder Reflow Chip Joints by Hamilton et al. vol. 14 No. 1 pp. 257 and 258, Jun. 1971.
French Search Report from French Patent application No. 95 06328, filled May 29, 1995.
IBM Technical Disclosure Bulletin, vol. 36, No. 10, Oct. 1993, New York US, pp. 481-483, "Ball Limiting Annulus Structure For C4 Bump Formation".

Affiliated with

Also associated with

Rating

Chip card micromodule as a surface-mount device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip card micromodule as a surface-mount device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip card micromodule as a surface-mount device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1381316