Chip bonding method and apparatus

Details Chip bonding method and apparatus Chip bonding method and apparatus

1994-07-22

1996-12-03

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 495, 29743, H01L 2150

Patent

active

055799809

ABSTRACT:
Method and apparatus for removing a chip from a bonding stage of a bonding machine via a vacuum suction of a collet upon exceeding a predetermined heating time so as to avoid thermal damage of the chip. The collet which vacuum-chucks the chip is moved vertically and then circularly by means of a combination of a drive shaft, a cam follower and a cylindrical cam holder so that the vacuum-chucked chip can be returned to the bonding stage or be transferred to other places.

REFERENCES:
patent: 4878610 (1989-11-01), Mori et al.

Affiliated with

Also associated with

Rating

Chip bonding method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip bonding method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip bonding method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-779626