Chip bonding heater with differential heat transfer

Details Chip bonding heater with differential heat transfer Chip bonding heater with differential heat transfer

2007-02-13

2007-02-13

Campbell, Thor (Department: 3742)

Electric heating

Heating devices

With heating unit structure

C219S209000, C438S051000

Reexamination Certificate

active

11156064

ABSTRACT:
A heater for flip chip bonding transfers more heat to the periphery of a die than to the center. This may result in a more even temperature profile along the die and may help prevent epoxy voiding problems.

REFERENCES:
patent: 3289046 (1966-11-01), Carr
patent: 3547604 (1970-12-01), Davis et al.
patent: 5951893 (1999-09-01), Bitko et al.
patent: 6614003 (2003-09-01), Hembree et al.
patent: 6770164 (2004-08-01), Schrock et al.
patent: 6940053 (2005-09-01), Shi
patent: 2002/0060368 (2002-05-01), Jiang
patent: 2003/0194833 (2003-10-01), Quinones et al.

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