Chip board and a process for the preparation thereof

Stock material or miscellaneous articles – Composite – Of aldehyde or ketone condensation product

Reexamination Certificate

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Details

C428S528000, C428S532000, C428S535000, C428S536000, C428S537100

Reexamination Certificate

active

07323253

ABSTRACT:
A chip board including an intermediary layer (1) and a layer (2) of large chips positioned on both sides of said intermediary layer. An outer layer (3) is provided on the 5 outer surface of each layer of large chips. In addition to the chips, the layers include an adhesive. The intermediary layer (1) includes a mixture of wood chips having chip fractions of a chip size of 0.1 to 20 mm, and the chips of this layer are randomly oriented. The individual chip in the layer (2) of large chips presents the following characteristics: a length of approx. 50 to approx. 130 mm, a width of approx. 4 to approx. 40 mm and a thickness of approx. 0.2 to approx. 2.0 mm. The chips within each layer (2) of large chips are all oriented in one and the same direction. As a result, a chip board is obtained which demonstrates a significantly higher E-module and stiffness in flexure than hitherto known despite a reduced consumption of material.

REFERENCES:
patent: 4364984 (1982-12-01), Wentworth
patent: 5183622 (1993-02-01), Persson
patent: 7004300 (2006-02-01), Bossler

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