Chip attack protection

Details Chip attack protection Chip attack protection

2011-06-21

2011-06-21

Hoffman, Brandon S (Department: 2433)

Information security

Protection of hardware

Reexamination Certificate

active

07966666

ABSTRACT:
A system for protecting a chip with an integrated circuit disposed on a first surface, the system including, disposed on the first surface, a first antenna, signal analyzer, chip controller and a signal generator which is operative to supply an outbound signal for transmission by the first antenna, a circuit arrangement, disposed on a second surface of the chip, including a shielding arrangement and a second antenna to receive the outbound signal, the circuit arrangement being operative to transmit a return signal from the second antenna to the first antenna, such that a breach in the shielding arrangement results in a change in, or cessation of, the return signal for detection by the signal analyzer, and a chip controller disposed on the first surface being operative to perform an action on the integrated circuit in response to the detection of the breach. Related apparatus and methods also included.

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Hideki Takagi et al., “Aligned room-temperature bonding of silicon wafers in vacuum by argon beam surface activation” Journal of Micromechanics and Microengineering (vol. 15, pp. 290-295) (Institute of Physics Publishing, 2005).
Oct. 13, 2010 Office Communication in connection with prosecution of EP 06 82 1637.3.

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