Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-01-03
2006-01-03
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S106000
Reexamination Certificate
active
06982190
ABSTRACT:
A design and method for attaching an RFID chip to a conductive pattern is disclosed. According to the invention, multiple die are aligned with respective multiple conductive modules for structural and electrical attachment. As disclosed, the multiple die can be attached near simultaneously and without the need for intermediate handling. Therefore, substantial cost benefits are realized. Also disclosed is a method of making electrical connections employing the use of a laser. A photosensitive adhesive material is used to structurally secure the attachment.
REFERENCES:
patent: 3722072 (1973-03-01), Beyerlein
patent: 3724068 (1973-04-01), Galli
patent: 3868764 (1975-03-01), Hartleroad et al.
patent: 5897337 (1999-04-01), Kata et al.
patent: 6093971 (2000-07-01), Oppermann et al.
Fish & Richardson P.C.
ID Solutions, Inc.
Lebentritt Michael
Stevenson Andre′
LandOfFree
Chip attachment in an RFID tag does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chip attachment in an RFID tag, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip attachment in an RFID tag will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3557907