Chip assembly

Details Chip assembly Chip assembly

1982-09-30

1985-08-20

Albritton, C. L.

Electric heating

Metal heating

By arc

361401, B23K 2600

Patent

active

045366381

ABSTRACT:
A chip substrate providing registration features for chip components on the opposite to the circuit side with interconnecting through holes and method and means for simultanuously trimming these registration features for dimentional and location accuracy, drilling the interconnecting through holes for perfect registration with the registration features, and photoetching the high density portion of the circuit in and around the chip area.

REFERENCES:
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 3910664 (1975-10-01), Pauza et al.
patent: 4143508 (1979-03-01), Ohno
patent: 4144648 (1979-03-01), Grovender

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