Chemicomechanical polishing device for a semiconductor wafer

Details Chemicomechanical polishing device for a semiconductor wafer Chemicomechanical polishing device for a semiconductor wafer

1997-09-17

2000-09-12

Banks, Derris H.

Abrading

Machine

Rotary tool

451446, B24B 500, B24B 2900

Patent

active

061169935

ABSTRACT:
A chemicomechanical polishing (CMP) apparatus for polishing a semiconductor wafer of the present invention includes a polishing pad and a wafer carrier disposed above the pad. A slurry feed port is positioned upstream of, but in the vicinity of, the wafer carrier in the direction of rotation of the polishing pad. Slurry is fed to the wafer supported by the wafer carrier via the slurry feed port. A slurry removing device is positioned downstream of the wafer carrier in the above direction. A conditioning mechanism for conditioning the pad is interposed between the wafer carrier and the slurry removing device.

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patent: 5578529 (1996-11-01), Mullins
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patent: 5649849 (1997-07-01), Pileri et al.
patent: 5651725 (1997-07-01), Kikuta et al.
patent: 5664990 (1997-09-01), Adams et al.
patent: 5665656 (1997-09-01), Jairath
patent: 5672095 (1997-09-01), Morimoto et al.
patent: 5709593 (1998-01-01), Guthrie et al.

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