Chemically bonded aggregate mold

Details Chemically bonded aggregate mold Chemically bonded aggregate mold

2007-01-23

2007-01-23

Kerns, Kevin (Department: 1725)

Metal founding

Process

Shaping a forming surface

C164S529000, C164S131000, C164S522000

Reexamination Certificate

active

10658919

ABSTRACT:
A mold for the casting of metals including an aggregate comprising a refractory particulate material and a soluble binder which provides for minimal heat transfer between the mold and the molten metal during filling. The aggregate preferably includes at least a proportion of particulate material having a heat diffusivity at least as low as silica sand to reduce the chilling effect of the mold. The mold is removed from the casting the action of a solvent, which simultaneously cools and solidifies the casting at a maximum rate. Processes for forming the mold and the casting of metals using the mold are also disclosed.

REFERENCES:
patent: 22865 (1859-02-01), Gardiner
patent: 185376 (1876-12-01), Whitehouse
patent: 381655 (1888-04-01), Stover
patent: 927495 (1909-07-01), Custer
patent: 1241867 (1917-10-01), McMillen
patent: 2968848 (1961-01-01), Carter
patent: 3124452 (1964-03-01), Kraft
patent: 3540519 (1970-11-01), Yates
patent: 3620291 (1971-11-01), Delachapelle
patent: 3863702 (1975-02-01), Hallerberg et al.
patent: 3958619 (1976-05-01), Petersen et al.
patent: 4222429 (1980-09-01), Kemp
patent: 4347890 (1982-09-01), Ailin-Pyzik et al.
patent: 4399858 (1983-08-01), Kurabe et al.
patent: 4548256 (1985-10-01), Glinn et al.
patent: 4580616 (1986-04-01), Watts
patent: 4582118 (1986-04-01), Jacoby et al.
patent: 4607091 (1986-08-01), Schreiber
patent: 4610295 (1986-09-01), Jacoby et al.
patent: 4629708 (1986-12-01), Alexander et al.
patent: 4709740 (1987-12-01), Jacoby et al.
patent: 4724887 (1988-02-01), Jacoby et al.
patent: 4802525 (1989-02-01), Heine et al.
patent: 4971134 (1990-11-01), Kawaguchi et al.
patent: 4987950 (1991-01-01), Yu
patent: 5143665 (1992-09-01), Clubbs et al.
patent: 5148853 (1992-09-01), Yu et al.
patent: 5158130 (1992-10-01), Sahari
patent: 5294648 (1994-03-01), Smith et al.
patent: 5327955 (1994-07-01), Easwaran
patent: 5333673 (1994-08-01), Hughes
patent: 5439045 (1995-08-01), Crafton
patent: 5573055 (1996-11-01), Melling et al.
patent: 5632326 (1997-05-01), Gough
patent: 5641015 (1997-06-01), Challand
patent: 5681407 (1997-10-01), Yu et al.
patent: 5725044 (1998-03-01), Hirokawa
patent: 5738162 (1998-04-01), Crafton
patent: 5810918 (1998-09-01), Landis
patent: 5820705 (1998-10-01), Yu et al.
patent: 5913354 (1999-06-01), Conroy et al.
patent: 5915452 (1999-06-01), Conroy et al.
patent: 5957188 (1999-09-01), Crafton
patent: 5983984 (1999-11-01), Auderheide et al.
patent: 6139619 (2000-10-01), Zaretskiy et al.
patent: 6286585 (2001-09-01), Twardowska et al.
patent: 6335387 (2002-01-01), Twardowska et al.
patent: 6336809 (2002-01-01), Crafton et al.
patent: 6372032 (2002-04-01), Miki
patent: 6390178 (2002-05-01), Makino
patent: 6416572 (2002-07-01), Eldemallawy et al.
patent: 6447593 (2002-09-01), Sargent et al.
patent: 6469299 (2002-10-01), Chutjian et al.
patent: 6547556 (2003-04-01), Crafton et al.
patent: 6551396 (2003-04-01), Pineda et al.
patent: 2002/0020511 (2002-02-01), Crafton et al.
patent: 2002/0104596 (2002-08-01), Crafton et al.
patent: 2004/0055728 (2004-03-01), Lewis, Jr. et al.
patent: 2005/0022957 (2005-02-01), Crafton et al.
patent: 2005/0072549 (2005-04-01), Crafton et al.
patent: 2005/0145362 (2005-07-01), Crafton et al.
patent: 622 726 (1981-04-01), None
patent: 32 15 809 (1983-11-01), None
patent: 36 16 168 (1987-11-01), None
patent: 195 25 307 (1997-01-01), None
patent: 0 141 666 (1985-05-01), None
patent: 0 119 365 (1987-09-01), None
patent: 0 744 233 (1996-11-01), None
patent: 0 796 681 (1997-09-01), None
patent: 2 614 814 (1988-11-01), None
patent: 1 549 220 (1979-07-01), None
patent: 2 070 627 (1981-09-01), None
patent: 2 248 569 (1992-04-01), None
patent: 59156566 (1984-09-01), None
patent: 61245938 (1986-11-01), None
patent: 5-169185 (1993-07-01), None
patent: 93 19870 (1993-10-01), None
Patent Abstracts of Japan; Publication No. 61007058; Publication Date Jan. 13, 1986.
Patent Abstracts of Japan, vol. 011, No. 094, Mar. 25, 1987 & JP 61 245938, Asahi Organic Chem. Ind. Co. Ltd., Nov. 1, 1986.
Veltrup E.M., “Kurze Entkernungszeiten Beim Entkernen Mit Hochdruckwasserstrah”, Giesserei, Giesserei Verlag, Dusseldorf, Germany, vol. 74, No. 4, Feb. 18, 1987, pp. 102-104.
Patent Abstracts of Japan, JP-60247458 (Mazda Motor Corp.) Dec. 7, 1985.
Niedling, Jake J. et al., “Evaluating RSI Sows For Safe Charging Into Molten Metal”, Light Metals 2003, TMS (The Minerals, Metals & Materials Society), 2003, pp. 695-700.
Ekenes, J. Martin et al., “Cause and Prevention of Explosions Involving Hot-Top Casting of Aluminum Extrusion Ingot”, Light Metals 2003, TMS (The Minerals, Metals & Materials Society), 2003, pp. 687-693.

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