Chemically adsorbed monomolecular lamination film

Details Chemically adsorbed monomolecular lamination film Chemically adsorbed monomolecular lamination film

1993-03-26

1995-01-10

Nakarani, D. S.

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Web or sheet containing structurally defined element or...

Physical dimension specified

428429, 428446, 428447, 428450, 428451, B32B 700

Patent

active

053805852

ABSTRACT:
The invention to provide a chemically adsorbed monomolecular lamination film comprising a chemically adsorbed monomolecular film formed via a siloxane-based monomolecular or polymer film on a substrate surface. It also seeks to provide a method of forming a chemically adsorbed monomolecular film efficiently and with high density on a substrate surface with few hydroxyl groups, which method comprises a step of contacting a substrate containing hydroxyl groups present on the surface with a non-aqueous solution containing a material with plural chlorosilanol groups in molecule, a step of removing the material remaining on the substrate without reaction by washing the substrate with a non-aqueous organic solution (if this process is omitted, the siloxane-based polymer film is prepared on the substrate), a step of forming a monomolecular film constituted by a compound containing a silanol group in molecule on the substrate by exposing to the air containing moisture or washing with water, after the removal step, and a step of laminating a monomolecular adsorption film by abosorbing a chlorosilane-based surface active agent constituted by a straight hydrocarbon chain having a chlorosilane groups at one end onto the substrate after the monomolecular or polymer film formation step.

REFERENCES:
patent: 4539061 (1985-09-01), Sagiv
patent: 4673474 (1987-06-01), Ogawa
patent: 4824766 (1989-04-01), Ogawa
patent: 4992300 (1991-02-01), Ogawa et al.
World Patents Index Latest, Derwent Publications Ltd., London, GB: AN 90-120634 & JP-A-2 071 873 (Japan Atomic Energy Res.), 12 Mar. 1990.
Netzer et al., "Thin Solid Films" 99:235-241 (1983).
Japan Society of Applied Physics Catalog No.: AP 901110-03.
Ogawa et al., "Langmuir" 6(4):851-856 (1990).
Mullin et al., "The American Physical Society", 39(7):3745-3747 (Apr. 1, 1989).
Netzer et al., "J. Am. Chem. Soc." 105:674-676 (1983).

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