Chemical vapor deposition techniques and related methods for...

Electrical generator or motor structure – Non-dynamoelectric – Thermal or pyromagnetic

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C136S254000

Reexamination Certificate

active

06411007

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention pertains to methods for manufacture of microminiature thermionic converters having high energy-conversion efficiencies and variable operating temperatures, using semiconductor integrated circuit fabrication and micromachine manufacturing techniques. The microminiature thermionic converters (MTCs) manufactured using the methods of the invention incorporate cathode to anode spacing of about 10 microns or less and use cathode and anode materials having work functions ranging from about 1 eV to about 3 eV.
2. Description of the Related Art
Thermionic conversion has been studied since the late nineteenth century, but practical devices were not demonstrated until the mid-twentieth century. Thomas Edison first studied thermionic emission in 1883 but its use for conversion of heat to electricity was not proposed until 1915 by Schicter. Although analytical work on thermionic converters continued during the 1920's, experimental converters were not reported until 1941. The Russians, Gurtovy and Kovalenko, published data which demonstrated the use of a cesium vapor diode to convert heat into electrical energy. Practical thermionic conversion was demonstrated in 1957 by Herqvist in which efficiencies of 5-10% were reached with power densities of 3-10 W/cm
2
.
FIG. 1
illustrates the components and processes of a typical thermionic converter employing technology understood and applied prior to the present invention. A heat source
15
elevates the temperature of the emitter electrode
10
(typically, between 1400-2200 K). Electrons
50
are then thermally evaporated into the space, or interelectrode gap (IEG)
5
, between the emitter electrode
10
and collector electrode
20
. The electrodes are operated in a vacuum, near vacuum, or in low pressure vapor (less than several torr)
65
within a vacuum or rarefied vapor enclosure
60
. The collector electrode
20
is cooled by a heat sink
25
and kept at a low temperature. The electrons
50
travel across the IEG
5
toward the collector electrode
20
and condense on the collector electrode
20
. The electrons
50
then return to the emitter electrode
10
through the electrical leads
30
, electrical terminals
35
and load
40
which connect the collector to the emitter. The figure shows an example configuration wherein the rarefied enclosure
60
, itself, functions as a conduit of heat addition on one side and heat removal on the other. Alternatively, it is possible for the heat source and heat sink to be positioned inside enclosure
60
and function independently from it.
Thermionic emission depends on emission of electrons from a hot surface. Valence electrons at room temperature within a metal are free to move within the atomic lattice but very few can escape from the metal surface. The electrons are prevented from escaping by the electrostatic image force between the electron and the metal surface. The heat from the emitting surface gives the electrons sufficient energy to overcome the electrostatic image force. The energy required to leave the metal surface is referred to as the material work function, ø. The rate at which electrons leave the metal surface is given by the Richardson-Dushman equation:
J=AT
2
exp(−
eø/kT
),
where A is a universal constant, T is the emitter temperature, k is the Boltzmann constant, and ø is the emitter work function. Large emission current densities are achieved by choosing an emitter with low work function and operating that emitter at as high a temperature as possible, with the following limitations. Very high temperature operation may cause any material to evaporate rapidly and limit emitter lifetime. Low work function materials can have relatively high evaporation rates and must be operated at lower temperatures. Materials with low evaporation rates usually have high work functions.
Choosing the correct electrode material is a key component of designing functional thermionic converters. A general description of suitable materials is presented here in association with disclosing the principles of the converters of the present invention. Example materials suitable for the microminiature thermionic converters of the present invention and others (as well as methods for making them) are disclosed in a separate patent application (Ser. No. 09/257,336). That separate patent application is incorporated herein in its entirety. (Other patent applications that are likewise incorporated herein in their entirety are [Attorney Docket Number SD-5987.2 and Attorney Docket Number SD-5987.4].)
Once the electrons are successfully emitted, their continued travel to the collector must be ensured. Electrons that are emitted from the emitter produce a space charge in the IEG. For large currents, the buildup of charge will act to repel further emission of electrons and limit the efficiency of the converter. Two options have been considered to limit space charge effects in the IEG: thermionic converters with small interelectrode gap spacing (the close-spaced vacuum converter) and thermionic converters filled with ionized gas.
Thermionic converters with gas in the IEG are designed to operate with ionized species of the gas. Cesium vapor is the gas most commonly used. Cesium has a dual role in thermionic converters: 1) space charge neutralization and 2) electrode work function modification. In the latter case, cesium atoms adsorb onto the emitter and collector surfaces. The adsorption of the atoms onto the electrode surfaces results in a decrease of the emitter and collector work functions, allowing greater electron emission from the hot emitter. Space charge neutralization occurs via two mechanisms: 1) surface ionization and 2) volumetric ionization. Surface ionization occurs when a cesium atom comes into contact with the emitter. Volumetric ionization occurs when an emitted electron inelastically collides with a Cs atom in the IEG. The work function and space charge reduction increase the converter power output. However, at the cesium pressures necessary to substantially affect the electrode work functions, an excessive amount of collisions (more than that needed for ionizations) occurs between the emitted electrons and cesium atoms, resulting in a loss of conversion efficiency. Therefore, the cesium vapor pressure must be controlled so that the work function reduction and space charge reduction effects outweigh the electron-cesium collision effect. An example of an operational thermionic converter is that found on the Russian TOPAZ-II space reactor. These converters operate at the emitter temperatures of 1700 K and collector temperatures of 600 K with cesium pressure in the IEG of just under one torr. Typical current densities achieved are <4 amps/cm
2
at output voltages of approximately 0.5 V. These converters operate at an efficiency of approximately 6%. The control of cesium pressure in the IEG is critical to operating these thermionic converters at their optimum efficiency.
A variety of thermionic converters are disclosed in the literature, including close-spaced converters. (See: Y. V. Nikolaev, et al., “Close-Spaced Thermionic Converters for Power Systems”, Proceedings Thermionic Energy Conversion Specialists Conference (1993); G. O. Fitzpatrick, et al., “Demonstration of Close-Spaced Thermionic Converters”, 28
th
Intersociety Energy Conversion Engineering Conference (1993); Kucherov, R. Ya., et al., “Closed Space Thermionic Converter with Isothermic Electrodes”, 29th Intersociety Energy Conversion Engineering Conference (1994); and G. O. Fitzpatrick, et al., “Close-Spaced Thermionic Converters with Active Spacing Control and Heat-Pipe Isothermal Emitters”, 31
st
Intersociety Energy Conversion Engineering Conference (1996).) Previously demonstrated thermionic converters, however, have not been able to achieve the current densities and conversion efficiencies predicted for the present invention. Others' efforts in the field of close-space converters demonstrate that expense and difficulty arise as a result of

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Chemical vapor deposition techniques and related methods for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical vapor deposition techniques and related methods for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical vapor deposition techniques and related methods for... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2965207

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.