Coating processes – Coating by vapor – gas – or smoke – Mixture of vapors or gases utilized
Patent
1996-10-01
1999-06-29
King, Roy V.
Coating processes
Coating by vapor, gas, or smoke
Mixture of vapors or gases utilized
427255, 4272551, C23C 1608
Patent
active
059166347
ABSTRACT:
A method of depositing a ternary, refractory based thin film on a substrate by chemical vapor deposition employing precursor sources of tungsten comprising WF.sub.6, either silicon or boron, and nitrogen. The result is a W--Si--N or W--B--N thin film useful for diffusion barrier and micromachining applications.
REFERENCES:
patent: 4640004 (1987-02-01), Thomas et al.
patent: 5254499 (1993-10-01), Sandhu et al.
patent: 5276405 (1994-01-01), Doan et al.
patent: 5278100 (1994-01-01), Doan et al.
patent: 5344792 (1994-09-01), Sandhu et al.
patent: 5369300 (1994-11-01), Heideman et al.
patent: 5378501 (1995-01-01), Foster et al.
patent: 5416045 (1995-05-01), Kauffman et al.
Dutron et al, "Morphology and Thermal Stability of M-Si-N (M=Re, W, Ta) for Microelectronics," J. Phys. IV, 5 (C5, Chemical Vapors Deposition, vol. 2), C5/1141-C5/1148, 1995 No Month Data is Available|.
Pierson, "Handbook Of Chemical Vapor Deposition (CVD) Principles, Technology and Applications", Noyes Publications, 1992, pp. 61,148-150 and 247-248. No Month Data is Available|.
Eizenberg, M., et al. "TiCN: A New Chemical Vapor Deposited Contact Barrier Metallization for Submicron Devices," Appl. Phys. Lett, vol. 65, No. 19 pp. 2416-2418 (Nov. 7, 1994).
Kolawa, E., et al., "Sputtered Ta-Si-N Diffusion Barriers in Cu Metallizations for Si," IEEE Electron Device Letters, vol. 12, No. 6, pp. 321-323, (Jun. 1991).
Kolawa, E., et al., "Amorphous W.sub.40 Re.sub.40 B.sub.20 Diffusion Barriers for (Si)/AL and (Si)/Cu Mettalizations," Thin Solid Films, vol. 236 pp. 301-305 (1993) No Month Data is Available|.
Lin, Kun-Chuan, et al., "TiWN Schottky Contacts to n-Ga.sub.0.15 In.sub.0.49 P," Jpn. J. Appl. Phys., vol. 33, Pt. 1, No. 8, pp. 4546-4549 (1994) No Month Data is Available|.
Reid, J.S., et al, "Thermodynamics of (Cr, Mo, Nb, Ta, V, or W)-Si-Cu Ternary Systems," J. Mater. Res., vol. 7, No. 9, pp. 2424-2428 (Sep. 1992).
Reid, J.S., et al., "Evaluation of Amorphous (Mo, Ta, W)-Si-N Diffusion Barriers for (Si).vertline.Cu Mettalizations," Thin Solid Films, vol. 236, pp. 319-324 (1993) No Month data is Available|.
Reid, J.S., et al., "W-B-N Diffusion Barriers for Si/Cu Mettalizations," Thin Solid Films, vol. 262, p. 218--(1995) No Month Data is Available|.
Smith, P.M., "Chemical Vapor Deposition of Ternary Refractory Nitrides for Diffusion Barrier Applications," VMIC Conference, pp. 162-167 (Jun. 18-20, 1996).
Bernard Claude
Custer Jonathan S.
Fleming James G.
Jones Ronald V.
Madar Roland
King Roy V.
Sandia Corporation
LandOfFree
Chemical vapor deposition of W-Si-N and W-B-N does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chemical vapor deposition of W-Si-N and W-B-N, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical vapor deposition of W-Si-N and W-B-N will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1374132