Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent
1992-12-16
1993-10-12
Owens, Terry J.
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
4272552, 4272555, 4272557, 427573, 427585, 118719, 118724, 118725, C23C 1646
Patent
active
052523667
ABSTRACT:
An actively cooled effuser for a vapor deposition reactor is placed in very close proximity to a substrate. The actively cooled effuser has combinations of gas directing plates, cooling plates and isolation plates attached together. Reactants and coolant are input into the stack of plates so formed. Selective heating of the substrate surface may occur through the use of heating lamps. Multiple units of the actively cooled effuser and heating lamps may be used in the reactor to form multiple layers on the substrate. The cooling plate has a cooling channel within a few thousandths of an inch of the output side of the stack. The presence of the cooling plates allows the effuser to be placed in very close proximity to the selectively heated substrate.
REFERENCES:
patent: 4625678 (1986-12-01), Shioya et al.
patent: 4736705 (1988-04-01), Weyburne
patent: 4854263 (1989-08-01), Chang et al.
patent: 4913090 (1990-04-01), Harada et al.
patent: 5000113 (1991-03-01), Wang et al.
Ahern Brian S.
Weyburne David W.
Collier Stanton E.
Owens Terry J.
Singer Donald J.
The United States of America as represented by the Secretary of
LandOfFree
Chemical vapor deposition method using an actively cooled effuse does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chemical vapor deposition method using an actively cooled effuse, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical vapor deposition method using an actively cooled effuse will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1903043