Chemical vapor deposition apparatus having cooling heads adjacen

Details Chemical vapor deposition apparatus having cooling heads adjacen Chemical vapor deposition apparatus having cooling heads adjacen

1988-09-20

1990-04-03

Bueker, Richard

Coating apparatus

Gas or vapor deposition

With treating means

118718, 118719, 118725, 4273984, C23C 1644

Patent

active

049130900

ABSTRACT:
A single chamber apparatus for chemical vapor deposition of films on semiconductor substrates transported through the chamber. Heaters and a plurality of gas dispersing heads are disposed in the chamber for forming films by chemical vapor deposition. A cooling head is disposed between each adjacent pair of gas dispersing heads for cooling whereby the surface temperature of the substrates opposite the gas dispersing heads is substantially equal to that of the substrates located opposite the cooling heads.

REFERENCES:
patent: 3785853 (1974-01-01), Kirkman et al.
patent: 4423701 (1984-01-01), Nath et al.
patent: 4664951 (1987-05-01), Doehler
patent: 4803947 (1989-02-01), Ueki et al.
Amick et al., "Deposition Techniques . . . Semiconductor Devices", J. Vac. Sci. Technol., vol. 4, No. 5, 9-10/1977, pp. 1053-1063.

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