Chemical vapor deposition apparatus having an ejecting head for

Details Chemical vapor deposition apparatus having an ejecting head for Chemical vapor deposition apparatus having an ejecting head for

1988-03-03

1989-05-02

Lawrence, Evan

Coating apparatus

Gas or vapor deposition

With treating means

118728, 118715, C23C 1644

Patent

active

048258091

ABSTRACT:
A chemical vapor deposition apparatus for ejecting reaction gas over an object on which a layer of the reaction gas is to be deposited has an ejecting head which develops a uniformly distributed laminated flow of the reaction gas along its inner surface. The ejecting head is formed from an inverted conical housing portion and a circular perforated plate covering the open end thereof. An ejecting member protrudes into a top end of the head and ejects the gas into the space inside the head in predetermined directions. The housing encloses the ejecting member and directs the gas ejected from the ejecting member to flow downward along the inner surface thereof in a laminated state. The laminated flow of gas continues onto the perforated plate, on which it flows centripetally along the inner surface thereof, being ejected evenly downward from the plate through holes in the plate. As a result, a laminated flow of homogeneous reaction gas is ejected toward the object, growing a chemical vapor deposition layer of high quality over the object.

Affiliated with

Also associated with

Rating

Chemical vapor deposition apparatus having an ejecting head for does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical vapor deposition apparatus having an ejecting head for , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical vapor deposition apparatus having an ejecting head for will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-577897