Chemical vapor deposition apparatus

Details Chemical vapor deposition apparatus Chemical vapor deposition apparatus

1992-03-18

1994-02-22

Bueker, Richard

Coating apparatus

Control means responsive to a randomly occurring sensed...

Responsive to condition of coating material

118710, 118712, 118715, 118726, C23C 1600

Patent

active

052883256

ABSTRACT:
In a chemical vapor deposition apparatus in which a liquid raw material is vaporized by bubbling and the vaporized material is used as a raw material gas, an orifice is provided in a pipe between a reaction unit (a dispersion head) and a vaporizing unit (a bubbler), whereby the pressure in the vaporizing unit is controlled so that it is made higher than that in the reaction unit. Instability of the pressure in the vaporizing unit which occurs in the initial phase of film formation is eliminated so that the film formation can be stably performed.

REFERENCES:
patent: 4393013 (1983-07-01), McMenamin
patent: 4625678 (1986-12-01), Shioya
patent: 4761269 (1988-08-01), Conger
patent: 4783343 (1988-11-01), Sato
patent: 5000113 (1991-03-01), Wang
Powell, Vapor Deposition, John Wiley & Sons, Inc. N.Y. .COPYRGT.1966, pp. 269-271.

Affiliated with

Also associated with

Rating

Chemical vapor deposition apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical vapor deposition apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical vapor deposition apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-168351