Chemical vapor deposition and powder formation using thermal spr

Details Chemical vapor deposition and powder formation using thermal spr Chemical vapor deposition and powder formation using thermal spr

1999-04-16

2000-10-17

Meeks, Timothy

Plastic and nonmetallic article shaping or treating: processes

Formation of solid particulate material directly from molten...

264 7, 264 12, 427450, 427576, 427577, 4272491, B29B 900

Patent

active

061326534

ABSTRACT:
A method for chemical vapor deposition using a very fine atomization or vaporization of a reagent containing liquid or liquid-like fluid near its supercritical temperature, where the resulting atomized or vaporized solution is entered into a flame or a plasma torch, and a powder is formed or a coating is deposited onto a substrate. The combustion flame can be stable from 10 torr to multiple atmospheres, and provides the energetic environment in which the reagent contained within the fluid can be reacted to form the desired powder or coating material on a substrate. The plasma torch likewise produces the required energy environment, but, unlike the flame, no oxidizer is needed so materials stable in only very low oxygen partial pressures can be formed. Using either the plasma torch or the combustion plasma, coatings can be deposited and powders formed in the open atmosphere without the necessity of a reaction chamber, but a chamber may be used for various reasons including process separation from the environment and pressure regulation.

REFERENCES:
patent: H1839 (2000-02-01), Combes et al.
patent: 4582731 (1986-04-01), Smith
patent: 4734227 (1988-03-01), Smith
patent: 4734451 (1988-03-01), Smith
patent: 4970093 (1990-11-01), Sievers et al.
patent: 5032568 (1991-07-01), Lau et al.
patent: 5213851 (1993-05-01), Snyder et al.
patent: 5716558 (1998-02-01), Nielsen et al.
patent: 5833891 (1998-11-01), Subramaniam et al.
patent: 5840774 (1998-11-01), Ehrlich et al.
patent: 5910298 (1999-06-01), Yamasaki et al.

Affiliated with

Also associated with

Rating

Chemical vapor deposition and powder formation using thermal spr does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical vapor deposition and powder formation using thermal spr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical vapor deposition and powder formation using thermal spr will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-465312