Chemical treatment method

Details Chemical treatment method Chemical treatment method

2008-09-26

2011-12-13

Vinh, Lan (Department: 1713)

Etching a substrate: processes

Nongaseous phase etching of substrate

C216S091000, C438S754000, C156S345510

Reexamination Certificate

active

08075791

ABSTRACT:
A chemical treatment apparatus and a method for performing a chemical treatment of a wafer, etc., by supplying a chemical via a cell. The apparatus includes a cylindrical inner cell and a cylindrical outer cell with open ends disposed at an outer circumference of the inner cell. The outer cell is axially movable to vary the width of a slit formed between a bottom end of the outer cell and a top surface of the substrate-holding means by the axial movement, thereby adjusting the discharge rate of the chemical and varying the pressure of the chemical.

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