Chemical treatment apparatus and chemical treatment method

Details Chemical treatment apparatus and chemical treatment method Chemical treatment apparatus and chemical treatment method

1998-09-22

2000-12-05

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

438745, 134 2, 134 24, 134 55, C23F 102, H01L 21302

Patent

active

061561533

ABSTRACT:
A chemical treatment apparatus including a treatment tank filled with chemical with which wafers are treated, and a jet pipe having chemical jetting holes which is provided at the bottom portion of the treatment tank and jets the chemical from the jetting holes thereof, the jetting holes containing at least first jetting holes for jetting the chemical upwardly and second jetting holes for jetting the chemical in a direction different from that of the first holes. The second direction is set to a direction within the range from the horizontal direction of the jet pipe to the obliquely downward direction at 45 degrees with respect to the horizontal direction.

REFERENCES:
patent: 5315793 (1994-05-01), Peterson et al.
patent: 5651836 (1997-07-01), Suzuk
patent: 5782990 (1998-07-01), Murakami et al.
patent: 5922138 (1999-07-01), Shindo et al.

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