Chemical solder comprising a metal salt, polyphthalaldehyde and

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

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148 22, 148 24, 228209, 524401, C08K 310

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active

051323516

ABSTRACT:
A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal.
A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.

REFERENCES:
patent: 2566339 (1951-09-01), Klinker
patent: 3069765 (1962-12-01), Simpelaar
patent: 4496694 (1985-01-01), Forgo et al.
patent: 4837286 (1989-01-01), Kato et al.
J. Electrochem. So. Solik-State Science and Technology, vol. 132, No. 6, 1985, pp. 1437-1440; A. Auerbach "Method for Reducing Metal Salts Complexed in a Polymer Host with a Laser."

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