Chemical metallization of electrically non-conducting porous sub

Details Chemical metallization of electrically non-conducting porous sub Chemical metallization of electrically non-conducting porous sub

1991-08-26

1997-01-21

Utech, Benjamin

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427305, 427306, 427437, 4274431, B05P 304

Patent

active

055957870

ABSTRACT:
A chemical metallization process is used for electrically non-conducting porous substrates, in needle felts, nonwovens or open-pored foams which possesses a porosity of from 40 to 97%. The metallization follows activation of the fiber surfaces or of the surfaces of the pore walls with a noble metal-containing solution. The volume of the chemical metallizing solution used is reduced to produce a considerable reduction in the operating costs, not only in respect of the solution itself but also in respect of the disposal of the waste water from the chemical metallization. Since less waste water is produced from the start in the chemical metallization process, a considerable contribution to the protection of the environment results.

REFERENCES:
patent: 3914520 (1975-10-01), Hovey
patent: 3967010 (1976-06-01), Maekawa
patent: 4002779 (1977-01-01), Nischwitz
patent: 4201825 (1980-05-01), Ebneth
patent: 4315045 (1982-02-01), Dillard
patent: 4335164 (1982-06-01), Dillard
patent: 4645573 (1987-02-01), Orban
patent: 4716055 (1987-12-01), Sanders
patent: 4720400 (1988-01-01), Manniso
patent: 4835015 (1989-05-01), Kistrup
patent: 4925706 (1990-05-01), Kistrup
patent: 5089301 (1992-02-01), Kistrup

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