Chemical-mechanical polishing using curved carriers

Details Chemical-mechanical polishing using curved carriers Chemical-mechanical polishing using curved carriers

1997-01-21

1998-06-16

Morgan, Eileen P.

Abrading

Abrading process

Glass or stone abrading

451285, 451287, 451289, 451388, 451398, B24B 700

Patent

active

057660581

ABSTRACT:
Uniform planarization of a patterned semiconductor wafer is effected with a chemical-mechanical polishing apparatus containing a base plate comprising a convex surface portion.

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Kaufman et al. in "Chemical-Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects," J. Electrochem. Soc., vol. 138, No. 11, Nov. 1991, pp. 3460-3464.
Ali et al., "Chemical-mechanical polishing of interlayer dielectric: A review," Solid-State Technology, Oct. 1994, pp. 63-68.
"Applied Optics" by Levi, John Wiley & Sons, 1968, pp. 424-425 Product Brochures and Chart by Rodel, Jun. and Dec., 1994.

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