Chemical mechanical polishing system

Details Chemical mechanical polishing system Chemical mechanical polishing system

2006-11-14

2006-11-14

Rachuba, M. (Department: 3723)

Abrading

Machine

Rotary tool

C451S287000

Reexamination Certificate

active

07134947

ABSTRACT:
According to one embodiment of the invention, a chemical mechanical polishing system includes a platen having a first surface adapted to couple a polishing pad thereto. The first surface includes a generally circular center portion and an annular portion surrounding the generally circular center portion. The generally circular center portion encloses an area and has an attachment surface area that is less than the area enclosed by the generally circular center portion. The attachment surface area is adapted to couple an inner portion of the polishing pad to the platen.According to one embodiment of the invention, a chemical mechanical polishing system includes a platen having a first surface coupling a polishing pad thereto. The first surface includes a generally circular center portion and an annular portion surrounding the generally circular center portion. The generally circular center portion encloses an area and has an attachment surface area that is less than the area enclosed by the generally circular center portion. The attachment surface area is coupling an inner portion of the polishing pad to the platen.

REFERENCES:
patent: 6036586 (2000-03-01), Ward
patent: 6220942 (2001-04-01), Tolles et al.
patent: 6299515 (2001-10-01), Beardsley et al.
patent: 6398905 (2002-06-01), Ward
patent: 6422921 (2002-07-01), Ettinger
patent: 6607429 (2003-08-01), Damgaard
patent: 6663472 (2003-12-01), Lim et al.

Affiliated with

Also associated with

Rating

Chemical mechanical polishing system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical mechanical polishing system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical mechanical polishing system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3690143