Abrading – Precision device or process - or with condition responsive... – By optical sensor
Patent
1999-06-19
2000-06-20
Rose, Robert A.
Abrading
Precision device or process - or with condition responsive...
By optical sensor
451288, B24B 4912, B24B 722
Patent
active
06077147&
ABSTRACT:
A chemical-mechanical polishing station for polishing wafers. The polishing station comprises a slurry supplier, a polishing pad capable of collecting the slurry, and a polishing head capable of rotating a wafer and lowering the wafer onto the polishing pad in contact with the polishing pad and the slurry during a polishing session. The polishing head further includes a retaining ring for positioning the wafer. The retaining ring houses a light-emitting device capable of shining a beam of light onto the slurry and a light sensor for picking up the beam of light reflected back from the slurry. The exact polishing end-point can be decided by analyzing signals obtained from the light sensor.
REFERENCES:
patent: 5643048 (1997-07-01), Iyer
patent: 5836805 (1998-11-01), Obeng
patent: 5851136 (1998-12-01), Lee
Chen Hsueh-Chung
Lin Tsang-Jung
Wu Juan-Yuan
Yang Ming-Sheng
Rose Robert A.
United Microelectronics Corporation
LandOfFree
Chemical-mechanical polishing station with end-point monitoring does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chemical-mechanical polishing station with end-point monitoring , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical-mechanical polishing station with end-point monitoring will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1847577