Chemical mechanical polishing slurry pump monitoring system...

Details Chemical mechanical polishing slurry pump monitoring system... Chemical mechanical polishing slurry pump monitoring system...

2003-11-10

2008-08-19

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S060000, C451S446000

Reexamination Certificate

active

07413497

ABSTRACT:
According to one embodiment of the invention, a chemical mechanical polishing monitoring system includes a pump delivering a slurry to a polishing pad and a rotation sensing device coupled to the pump. The rotation sensing device senses a rotation of the pump and generates a signal indicative of the rotation of the pump.

REFERENCES:
patent: 6183341 (2001-02-01), Melcer
patent: 6413154 (2002-07-01), Togawa et al.
patent: 6676383 (2004-01-01), Schob

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