Chemical mechanical polishing slurry and method of...

Details Chemical mechanical polishing slurry and method of... Chemical mechanical polishing slurry and method of...

2007-03-06

2007-03-06

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S959000, C051S298000, C051S307000, C501S127000, C216S052000, C106S003000

Reexamination Certificate

active

10369647

ABSTRACT:
A chemical mechanical polishing slurry contains an alumina powder including α-alumina particles and at least one other alumina particles having a crystal structure different from that of α-alumina, and resin particles.

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Matsui et al (JP 200-269169) (cited on IDS) (Translation).
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