Abrasive tool making process – material – or composition – With inorganic material
Reexamination Certificate
2007-12-11
2007-12-11
Marcheschi, Michael (Department: 1755)
Abrasive tool making process, material, or composition
With inorganic material
C051S309000, C106S003000
Reexamination Certificate
active
10931846
ABSTRACT:
The present invention is directed to methods for polishing and cleaning a wafer having CoFeNi structures within alumina fill to achieve corrosion-free, smooth, and planar surface. A preferred chemical mechanical polishing (CMP) method includes a CMP polishing compound including alumina abrasive particulates, 1H-Benzotriazole (BTA), and hydrogen peroxide (H2O2) in a concentration working range of 4% to 12%. In a preferred embodiment the H2O2concentration is approximately 6% and the pH is approximately 4.0 at polishing pressure 6 psi. A cleaning solution for CoFeNi structures in alumina fill of the present invention preferably includes 4-Methyl-1H-Benzotriazole, 5-Methyl-1H-Benzotriazole, hydrogenated 4-Methyl-1H-Benzotriazole, hydrogenated 5-Methyl-1H-Benzotriazole, sodium octanoate, and water.
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Guthrie Hung-Chin
Jiang Ming
Lara Nick
Guillot Robert O.
Hitachi Global Storage Technologies - Netherlands B.V.
Intellectual Property Law Offices
Marcheschi Michael
LandOfFree
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