Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2006-04-11
2006-04-11
Ackun, Jr., Jacob K. (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S059000, C438S631000
Reexamination Certificate
active
07025661
ABSTRACT:
A high throughput chemical mechanical polishing process is disclosed. A substrate having thereon a top bulk metal layer and a lower barrier layer is prepared. The top bulk metal layer is polished at a substantial constant removal rate to expose the barrier layer by utilizing a first platen and first slurry being selective to the barrier layer. The exposed barrier layer is then polished by using a second platen and second slurry. The first slurry has a copper to barrier polishing selectivity of greater than 30.
REFERENCES:
patent: 4944836 (1990-07-01), Beyer et al.
patent: 5676587 (1997-10-01), Landers et al.
patent: 6573173 (2003-06-01), Farkas et al.
patent: 2002/0193050 (2002-12-01), Sharan
patent: 2003/0013306 (2003-01-01), Tsai et al.
patent: 2003/0098446 (2003-05-01), Puppe et al.
patent: 2003/0124862 (2003-07-01), Miyairi et al.
patent: 2003/0129838 (2003-07-01), Cadien et al.
patent: 2003/0143851 (2003-07-01), Cadien et al.
patent: 2003/0203705 (2003-10-01), Leng
patent: 2003/0228753 (2003-12-01), Hau-Riege et al.
patent: 2004/0116052 (2004-06-01), Chen et al.
patent: 2004/0171265 (2004-09-01), Ye et al.
patent: 2004/0266183 (2004-12-01), Miller et al.
patent: 2005/0090104 (2005-04-01), Yang et al.
Hsu Chia-Lin
Tsai Teng-Chun
Ackun Jr. Jacob K.
Hsu Winston
United Microelectronics Corp.
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